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GPP制程简介-双面光刻.ppt

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GPP制程简介-双面光刻.ppt
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GPP Process Introduction (Pt & SIPOS) GPP制程简介,Std GPP Process Flow,Wafer Clean,,Boron Diffusion,,Grid Etching,,PR Strip,,SIPOS & MTO,,2nd Photo,,,PG Burn off,,Glass Firing,,LTO,,3rd Photo,PG Coating,,RCA Clean,,PR Strip,Contact Etch,,,,,,,Non SIPOS,,Phos. Pre-Dep,HF Soak,Sand Blasting,Pt Diffusion,Sand Blasting,1st Photo,,,,,,,,,,,,,,,,Wafer Clean (晶片清洗),N,Phos. Pre-Deposition ( 磷預沉積 ),N,晶片,N+,磷,,Sand Blasting (吹砂),N,晶片,N+,磷,,在此面吹砂,,Boron Diffusion (硼擴散 ),N,晶片,N+,P+,磷,,硼,,Sand Blasting (吹砂),N,晶片,N+,P+,磷,,硼,,单面吹砂,,Pt Diffusion (铂擴),N,晶片,N+,P+,磷,,硼,,Pt,铂,,Sand Blasting (吹砂),N,晶片,N+,P+,磷,,硼,,,雙面吹砂,,1st Photo (一次黃光双面光刻),晶片,N,N+,P+,光阻,,,,,,,,光阻,,,开槽去,,背面标记线,SB-402,BG-403/S,Grid Pre-Etching (溝槽标记预蝕刻),晶片,N,N+,P+,,光阻,,,,,,,,,Pr-Coating (背面涂胶),晶片,N,N+,P+,光阻,,,,,,,,,,,补光阻保护,Grid Etching (溝槽蝕刻),晶片,N,N+,P+,光阻,,,,,,,,,,PR Strip (光阻去除),N,N+,P+,,,,,RCA Clean (RCA 清洗),晶片,N,N+,P+,,,,,SIPOS & MTO (SIPOS沉積),晶片,,N,N+,P+,,,,,SIPOS,,SIPOS,,,,,2nd Photo (2次黃光),,,N,N+,P+,,,,,SIPOS,,SIPOS,,PG,,,,,BG-401A(高光强型),或 BG-401A,BG-403,或 BG-401A,BG-401A(高光强型),或 BG-401A,BG-403,BG-401A(高光强型),或 BG-401A,PG Development (PG显影),,,,N,N+,P+,,,,,SIPOS,,SIPOS,,PG,,,,,,,Glass Firing (玻璃燒結),,,,N,N+,P+,,,SIPOS,,SIPOS,,Glass,,,,,,,,,LTO (低溫氧化層沉積),,,,,N,N+,P+,,,SIPOS,,SIPOS,Glass,,,,,,,,SiO2,,,,,,,3rd Photo (三次黃光),,,,,N,N+,P+,,,SIPOS,,SIPOS,Glass,,,,,,,SiO2,,,,,PR,,,,,,,BG-403,或 BG-401A,BG-401A(高光强型),Contact Etch (接觸面蝕刻),,,,N,N+,P+,SIPOS,Glass,,,,SiO2,,,PR,,,,,,,,,,,,,,,PR Strip (光阻去除),,,,N,N+,P+,SIPOS,Glass,,,,SiO2,,,,,,,,,,,,,,1st Ni Plating (一次鍍鎳),,,,N,N+,P+,SIPOS,Glass,,,,SiO2,,,,,,,,,,,,Ni,,,,,,,,Ni Sintering (鎳燒結),,,,N,N+,P+,SIPOS,Glass,,,,SiO2,,,,,,,,,,,,Ni,,,,,,,,2nd Ni Plating (二次鍍鎳),,,,N,N+,P+,SIPOS,Glass,,,,SiO2,,,,,,,,,,,,Ni,,,,,,,,,,,,Gold Plating (鍍金),,,,N,N+,P+,SIPOS,Glass,,,,SiO2,,,,,,,,,,,,Ni,,,,,,,Au,,,,,,,,,,,GPP Chip (GPP晶粒),,,Glass,LTO,P+,N+,,,,,,,,,,,,N,SIPOS,Ni/ Au,,,,,
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